Tchua
2021-08-05
Long Intel on it fixing its manufacturing problems
Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越3纳米芯片</blockquote>
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Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越了纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺回CPU制造的领先地位和个人电脑领域“毫无疑问的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们将如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官Pat Gelsinger和技术开发高级副总裁Ann Kelleher博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的10nm“增强型Superfin”现在只有“7”。这可能感觉有点口是心非——“只要挥挥魔杖，你就有更好的技术！”-但公平地说，工艺节点的纳米测量不再真正对应于任何物理事物，就密度而言，英特尔目前的10纳米芯片与台积电和三星的7纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>展望7纳米之后，英特尔的目标是制定积极的发布时间表，每年都会进行重大产品更新。我们预计今年秋天他们的Alder Lake芯片将混合高功率和低功率内核，随后是现在的4纳米Meteor Lake芯片，将转向“平铺”（chiplet）设计，并结合英特尔的<a href=\"https://laohu8.com/S/DDD\">3D</a>堆叠芯片技术。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于EUV的3纳米节点制定了技术，该节点将使用高能制造工艺来简化芯片创建，并为angstrom节点制定了“20A”技术。这是十亿分之一米（意味着它是2纳米），随后将是一个18A节点，英特尔希望在2025年开始生产，用于本十年后半期的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度约为2埃，因此这些晶体管非常微小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔在满足新节点目标方面没有最好的记录，但如果它甚至可以接近这些目标，预计您的笔记本电脑和台式机将在未来几年内获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越3纳米芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越3纳米芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p> Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way. Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越了纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺回CPU制造的领先地位和个人电脑领域“毫无疑问的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们将如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官Pat Gelsinger和技术开发高级副总裁Ann Kelleher博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的10nm“增强型Superfin”现在只有“7”。这可能感觉有点口是心非——“只要挥挥魔杖，你就有更好的技术！”-但公平地说，工艺节点的纳米测量不再真正对应于任何物理事物，就密度而言，英特尔目前的10纳米芯片与台积电和三星的7纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>展望7纳米之后，英特尔的目标是制定积极的发布时间表，每年都会进行重大产品更新。我们预计今年秋天他们的Alder Lake芯片将混合高功率和低功率内核，随后是现在的4纳米Meteor Lake芯片，将转向“平铺”（chiplet）设计，并结合英特尔的<a href=\"https://laohu8.com/S/DDD\">3D</a>堆叠芯片技术。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于EUV的3纳米节点制定了技术，该节点将使用高能制造工艺来简化芯片创建，并为angstrom节点制定了“20A”技术。这是十亿分之一米（意味着它是2纳米），随后将是一个18A节点，英特尔希望在2025年开始生产，用于本十年后半期的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度约为2埃，因此这些晶体管非常微小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔在满足新节点目标方面没有最好的记录，但如果它甚至可以接近这些目标，预计您的笔记本电脑和台式机将在未来几年内获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","INTC":"英特尔","03086":"华夏纳指"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"INTC":0.9,"09086":0.9,"03086":0.9}},"isVote":1,"tweetType":1,"viewCount":1521,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":["INTC"],"verified":2,"subType":0,"readableState":1,"langContent":"EN","currentLanguage":"EN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":43,"xxTargetLangEnum":"ORIG"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/899369802"}
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