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04-15
这篇文章不错，转发给大家看看
小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在
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start;\">2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。近期有消息称，小米15S Pro将首发搭载小米自研SoC芯片登场。日前，小米联合创始人、副董事长林斌也在微博上回复网友时首次确认了小米15S Pro新机的存在。但这款新机的具体规格，仍待小米官方确认。</p><p><strong>小米王化：手机产品部芯片平台部一直存在</strong></p><p>小米集团公关部总经理王化4月15日表示，手机产品部的芯片平台部一直存在，其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。王化称，“负责人秦牧云兄弟加入公司都有好几年了，至少我俩2021年就有小米办公的工作聊天记录了”。</p></body></html>","source":"sina_tech","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在</title>\n<style 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href=\"https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/99b330c7a5fe2b62c4d008bd67f85ddd","relate_stocks":{"01810":"小米集团-W"},"source_url":"https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1152471266","content_text":"新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及芯片研发制造能力的手机厂商。澎湃S1为8核64位处理器，采用28nm工艺制程，由小米5C首发搭载。不过这款手机并未成为爆款，也让小米澎湃S1蒙尘。此后，小米并未放弃自研芯片的梦想。近年来，小米在影像、快充、电源管理、通信、显示等多个领域推出了自研芯片，比如澎湃C系列影像芯片、澎湃P系列快充芯片、澎湃G系列电源管理芯片、澎湃T系列信号增强芯片、澎湃D系列独显芯片等，从小芯片入手积累能力。2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。近期有消息称，小米15S Pro将首发搭载小米自研SoC芯片登场。日前，小米联合创始人、副董事长林斌也在微博上回复网友时首次确认了小米15S Pro新机的存在。但这款新机的具体规格，仍待小米官方确认。小米王化：手机产品部芯片平台部一直存在小米集团公关部总经理王化4月15日表示，手机产品部的芯片平台部一直存在，其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。王化称，“负责人秦牧云兄弟加入公司都有好几年了，至少我俩2021年就有小米办公的工作聊天记录了”。","news_type":1},"isVote":1,"tweetType":1,"viewCount":37,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0}],"hots":[{"id":424750001815920,"gmtCreate":1744708177266,"gmtModify":1744709965413,"author":{"id":"4193801600623390","authorId":"4193801600623390","name":"大灰狼赫斯","avatar":"https://community-static.tradeup.com/news/default-avatar.jpg","crmLevel":7,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4193801600623390","idStr":"4193801600623390"},"themes":[],"htmlText":"这篇文章不错，转发给大家看看","listText":"这篇文章不错，转发给大家看看","text":"这篇文章不错，转发给大家看看","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/424750001815920","repostId":"1152471266","repostType":4,"repost":{"id":"1152471266","kind":"news","pubTimestamp":1744707815,"share":"https://www.laohu8.com/m/news/1152471266?lang=&edition=full","pubTime":"2025-04-15 17:03","market":"us","language":"zh","title":"小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在","url":"https://stock-news.laohu8.com/highlight/detail?id=1152471266","media":"新浪科技","summary":"新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此后，小米并未放弃自研芯片的梦想。2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。但这款新机的具体规格，仍待小米官方确认。","content":"<html><head></head><body><p style=\"text-align: start;\">新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。</p><p style=\"text-align: start;\">资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。</p><p style=\"text-align: start;\">此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及芯片研发制造能力的手机厂商。澎湃S1为8核64位处理器，采用28nm工艺制程，由小米5C首发搭载。不过这款手机并未成为爆款，也让小米澎湃S1蒙尘。</p><p style=\"text-align: start;\">此后，小米并未放弃自研芯片的梦想。近年来，小米在影像、快充、电源管理、通信、显示等多个领域推出了自研芯片，比如澎湃C系列影像芯片、澎湃P系列快充芯片、澎湃G系列电源管理芯片、澎湃T系列信号增强芯片、澎湃D系列独显芯片等，从小芯片入手积累能力。</p><p style=\"text-align: start;\">2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。近期有消息称，小米15S Pro将首发搭载小米自研SoC芯片登场。日前，小米联合创始人、副董事长林斌也在微博上回复网友时首次确认了小米15S Pro新机的存在。但这款新机的具体规格，仍待小米官方确认。</p><p><strong>小米王化：手机产品部芯片平台部一直存在</strong></p><p>小米集团公关部总经理王化4月15日表示，手机产品部的芯片平台部一直存在，其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。王化称，“负责人秦牧云兄弟加入公司都有好几年了，至少我俩2021年就有小米办公的工作聊天记录了”。</p></body></html>","source":"sina_tech","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在</title>\n<style 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margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-04-15 17:03 北京时间 <a href=https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml><strong>新浪科技</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及...</p>\n\n<a href=\"https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/99b330c7a5fe2b62c4d008bd67f85ddd","relate_stocks":{"01810":"小米集团-W"},"source_url":"https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1152471266","content_text":"新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及芯片研发制造能力的手机厂商。澎湃S1为8核64位处理器，采用28nm工艺制程，由小米5C首发搭载。不过这款手机并未成为爆款，也让小米澎湃S1蒙尘。此后，小米并未放弃自研芯片的梦想。近年来，小米在影像、快充、电源管理、通信、显示等多个领域推出了自研芯片，比如澎湃C系列影像芯片、澎湃P系列快充芯片、澎湃G系列电源管理芯片、澎湃T系列信号增强芯片、澎湃D系列独显芯片等，从小芯片入手积累能力。2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。近期有消息称，小米15S Pro将首发搭载小米自研SoC芯片登场。日前，小米联合创始人、副董事长林斌也在微博上回复网友时首次确认了小米15S Pro新机的存在。但这款新机的具体规格，仍待小米官方确认。小米王化：手机产品部芯片平台部一直存在小米集团公关部总经理王化4月15日表示，手机产品部的芯片平台部一直存在，其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。王化称，“负责人秦牧云兄弟加入公司都有好几年了，至少我俩2021年就有小米办公的工作聊天记录了”。","news_type":1},"isVote":1,"tweetType":1,"viewCount":37,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0}],"lives":[]}
